[Press Release]

BeSang Inc. is pleased to announce that “TRUE 3D” is now a Registered Trademark through the United States Patent and Trademark Office. BeSang’s “TRUE 3D” IC is not an off-chip 3D chip stacking technology with limited TSV interconnects, but a single-chip 3D IC solution with unrestricted 3D interconnects. There are many technologies that claim to be 3D IC although they are not – this is the philosophy behind BeSang’s “TRUE 3D” phrase.

See the original press release here: http://uspolitics.einnews.com/pr_news/99216178/true-3d-now-a-registered-trademark-of-besang-inc